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TDA2824
DUAL POWER AMPLIFIER
.SUPPLYVOLTAGEDOWNTO3V .HI .LOWCROSSOVERDI .LOWQUI .BRI
GH SVR
STORTION ESCENT CURRENT DGE OR STEREO CONFIGURATION
Powerd ip (12+2+2)
DESCRIPTION The TDA2824 is a monolithic integrated circuit in 12+2+2 powerdip, intended for use as dual audio power amplifier in portable radios and TV sets.
ORDERING NUMBER : TDA2824
TYPICAL APPLICATION CIRCUIT (Stereo)
R2
January 1995
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PIN CONNECTION
SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol VS IO Ptot Tstg, Tj Supply Voltage Output Peak Current Total Power Dissipation at Tamb = 50C Tamb = 70C Storage and Junction Temperature Parameter Value 16 1.5 1.25 4 -40 to 150 Unit V A W W C
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THERMAL DATA
Symbol R th j-amb Rth j-case Parameter Thermal Resistance Junction-ambient Thermal Resistance Junction-case Max. Max. Value 80 20 Un it C/W C/W
ELECTRICAL CHARACTERISTICS (VS = 6V, Tamb = 25C, unless otherwise specified)
Symbol Parameter Test Co nditi ons Min. Typ . Max. Un it
STEREO (test circuit of fig. 1)
VS VO Id Ib PO Supply Voltage Quiescent Output Voltage Quiescent Drain Current Input Bias Current Output Power (each channel) d = 10% VS = 9V VS = 6V VS = 4.5V f = 1KHz RL = 4 RL = 4 R L = 4 1.3 0.45 VS = 9V VS = 9V 3 4 2.7 6 100 1.7 0.65 0.32 0.2 36 100 B = 22Hz to 22KHz Curve A SVR CS Supply Voltage Rejection Channel Separation f = 100Hz R S = 10K f = 1KHz 40 2.5 2 50 50 39 41 12 15 V V V mA nA W W W % dB K V V dB dB
d GV Ri eN
Distortion Closed Loop Voltage Gain Input Resistance Total Input Noise
VS = 9V, f = 1KHz R L = 8, PO = 0.5W f = 1KHz f = 1KHz R S = 10K
BRIDGE (test circuit of fig. 2)
VS VOS Ib PO Supply Voltage Output Offset Voltage Imput Bias Current Output Power d = 10% VS = 9V VS = 6V VS = 4.5V R L = 8 f = 1KHz R S = 10K f = 100Hz B = 22Hz to 22KHz Curve A SVR Supply Voltage Rejection 48 f = 1KHz R L = 8 R L = 8 R L = 4 PO = 0.5W 2.5 0.9 R L = 8 100 3.2 1.35 1 0.2 39 3 2.5 60 3 15 60 V mV nA W W W % dB mV V dB
d GV eN
Distortion (f = 1KHz) Closed Loop Voltage Gain Total Input Noise
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Figure 1 : Test Circuit (stereo).
R2
Figure 2: P.C. Board and Component Layout of the Circuit of Figure 1. (1:1 scale)
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Figure 3 : Test Circuit (bridge).
Figure 4: P.C. Board and Component Layout of the Circuit of Figure 3. (1:1 scale)
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Figure 3 : Output Power vs. Supply Voltage (Stereo). Figure 4 : Output Power vs. Supply Voltage (Bridge).
Figure 5 : Distortion vs. Output Power (Bridge).
Figure 6 : Distortion vs. Output Power (Bridge).
Figure 7 : Supply Voltage Rejection vs. Frequency (Stereo)
Figure 8 : Quiescent Current vs. Supply Voltage.
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Figure 9 : Quiescent Current vs. Supply Voltage. Figure 10 : Total Power Dissipation vs. Output Power (Stereo).
Figure 11 : Total Power Dissipation vs. Output Power (Bridge).
Figure 12 : Total Power Dissipation vs. Output Power (Bridge).
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MOUNTING INSTRUCTION The Rth j-amb of the TDA2824 can be reduced by soldering the GND pins to a suitable copperarea of the printed circuit board (Figure 13) or to an external heatsink (Figure 14). The diagram of Figure 15 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side"" oftwo equalsquare copper areas having a thickness of 35 (1.4 mils). Figure 13 : Example of P.C. Board Copper Area which is used as Heatsink.
During soldering the pins temperature must not exceed 260 C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground.
Figure 14 : External Heatsink Mounting Example.
Figure 15 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance vs. Side "".
Figure 16 : Maximum Allowable Power Dissipation vs. Ambient Temperature.
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POWERDIP 12+2+2 PACKAGE MECHANICAL DATA
DIM. MIN. a1 B b b1 D E e e3 F I L Z 3.30 1.27 8.80 2.54 17.78 7.10 5.10 0.130 0.050 0.38 0.51 0.85 0.50 0.50 20.0 0.346 0.100 0.700 0.280 0.201 0.015 1.40 mm TYP. MAX. MIN. 0.020 0.033 0.020 0.020 0.787 0.055 inch TYP. MAX.
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Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1995 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A.
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